以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
This is the fourth episode but it's only been six minutes into the show because each episode is just 120 seconds. And rather than being a cliffhanger, this is how the episode opens.
，这一点在safew官方下载中也有详细论述
Christine RoTechnology Reporter
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"Of course, there were no women astronauts back then. But I just thought, I'll be a lady astronaut."